MODEL:
FPC-5210 Series
Intel® 12th Gen. CoreTM Embedded GPU Computer supporting Nvidia® RTX-A4500
- SMART FAN support
- 12th Generation CoreTM i9/i7/i5/i3 Processor (Alder Lake-S)
- Up to 120W GPU MXM module expansion
- 802.3af (15.4W) / 802.3at(25.5W) Gigabit PoE ports
- Wide range DC power input (9~36V)
- DP x2 + HDMI x 1 and DVI x 1 (support 4 independent displays)
- Power on/off delay control / configurable ignition power control
- Supports TPM 2.0 and Time-Sensitive Networking (TSN)
- Two-mPCIe for optional WiFi/3G/4G/GPS or I/O expansion supported
- 1 x M.2 B-Key for storge or 5G / LTE +1 x M.2 E-Key for WiFi / BT
- 1 x M.2 M-Key for NVMe SSD
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System |
|
CPU |
Intel® 12th generation Core™ i9/i7/i5/i3 Processor in LGA1700 socket |
Memory |
2 x 262-pin DDR5 SO-DIMM sockets, supporting 4800 MHz SDRAM up to 64GB |
Chipset |
Intel® R680E |
Graphics |
Integrated Intel® HD Graphics 770 |
ATA |
2 x Serial ATA ports with 600MB/s HDD transfer rate |
LAN Chipset FPC-5210-2M4/ FPC-5210-2P4 |
1 x Intel® I219LM GbE controller w/ iAMT 16.0 3 x Intel® I226 2.5GbE controllers 2 x Intel® I226 2.5GbE controllers for PoE 2 x Marvell® 10GbE controllers for PoE |
LAN Chipset FPC-5210-M4 |
1 x Intel® I219LM GbE controller w/ iAMT 16.0 3 x Intel® I226 2.5GbE controllers 2 x Inte® I210 GbE controllers for PoE 2 x Intel® I226 2.5GbE controllers for PoE |
Watchdog Timer |
1~255 levels reset |
TPM |
Infineon SLB9670 supports TPM 2.0 |
Environmental |
|
Operating Temp. |
-20 ~ 55°C (-4 ~ 131°F), ambient w/ air flow (w/ 65W TDP CPU,115W GPU) |
Storage Temp. |
-40 ~ 85°C (-40 ~ 185°F) |
Operating Humidity |
10 ~ 95% @ 55°C (non-condensing) |
Vibration |
5~500Hz 2G rms X,Y,Z axis w/SSD, according to IEC 60068-2-64 |
Shock |
30 Grms, Half-sine 11 m sec. duration w/ SSD, according IEC60068-2-27 |
Power Requirement |
|
Power Input |
DC 9~36V input ( w/ 4-pin DC input terminal block) ( V+ ,V+, V-, V-) |
Ignition Switch |
2-pin teminal block : IGN, GND |
Power Consumption |
Max. 280W |
Mechanical |
|
Construction |
Metal |
Mounting |
Wall-mount |
Weight |
4.68 Kg (10.32lb) |
Dimensions (W x D x H) |
285 x 230 x 130mm (11.2” x 9.05” x 5.12”) |
Ordering Information |
|
FPC-5210-2M4 |
Embedded GPU Computer, Bare BOM, w/2x 10GbE POEs, M12 type |
FPC-5210-2P4 |
Embedded GPU Computer, Bare BOM, w/2x 10GbE POEs, RJ45 type (BTO) |
FPC-5210-M4 |
Embedded GPU Computer, Bare BOM, w/4x M12 POEs |
I/O Interface |
|
Serial Port |
2 x RS-232/422/485 configurable ports via DB-9 connectors (Default RS232,Switch via BIOS) 2 x RS-232 ports via DB-9 connectors |
USB Port |
8 x USB 3.2 Gen2 ports |
LAN Port FPC-5210-2M4 |
4 x RJ-45 connectors for GbE 4 x M12 X-coded connectors by 2 x Intel® I226(2.5GbE) + 2 x Marvell® 10GbE, max 60W supports 802.3at POE+ |
LAN Port FPC-5210-2P4 |
4 x RJ-45 connectors for GbE 4 x RJ-45 connectors by 2 x Intel® I226(2.5GbE)+ 2 x Marvell® 10GbE, max 60W supports 802.3at POE+ |
LAN Port FPC-5210-M4 |
4 x RJ-45 connectors for GbE 4 x M12 X-coded connectors by 2 x Intel® I210(1GbE) + 2 x Intel® I226(2.5GbE) supports 802.3af POE |
Video Port |
2 x DP 1.4a from MXM module or Intel Graphics 1 x HDMI 2.0b female connector 1 x DVI-I female connector for digital/analog video output * Support 4 independent displays |
DIO Port |
1 x DB15 connector for 8 x digital input ( Dry/ Wet contact ) with 2KV isolation 1 x DB15 connector for 8 x digital output with 2KV isolation |
Expansion Bus |
1 x Mini-card socket interconnected with SIM card socket for optional Wi-Fi or LTE module(Full size) 1 x SIM socket/1 x CFast socket (outside accessible) |
Selectable Port |
1 x DB25 connector for DIO (8 in/8 out) port or LPT port (either one, default is DIO) |
Audio |
Mic-in/Line-out |
Expansion Bus |
for optional WiFi/BT/3G/LTE/GPS (PCIex1+USB2.0, Full Size) 3 x SIM socket ( 2 for mPCIe / 1 for M.2 B key ) 1 x M.2 B key (2242/3052/2280) w/(PCIex2+USB3.0+SATA ) interconnected with SIM for 5G / LTE or for storage (either one) 1 x M.2 E key (2230) with PCIex1+USB2.0+CNVi) for Wireless |
Qualification |
|
Certification |
CE, FCC Class A |
Storage |
|
Type |
2 x 2.5” outside accessible drive bays 1 x M.2 B key ( 2242/2280 ) w/ (PCIex2+USB+ SATA ) for storage or LTE expansion ( either one) 1 x M.2 2280 M key supports 2242,2280 devices (PCIe x4 & SATA signal, support boot up function) |
OS Support |
Windows 10 IOT Enterprise 64-bit Linux ( Ubuntu 20.04 ) |
Standard Accessories |
||
CPF-92Q0-C1 |
|
CPU Cooling for LGA1700 CPU |
Optional Accessories |
||
WMK-5210 |
|
Wall-mount kit for FPC-521x Series |
PAC-330W6B |
|
330W AC/DC adapter kit w/ 4-pin terminal block |
Optional Configuration (*CTOS Kit) |
||
MXM-KIT-A4500-8GB |
|
MXM 3.1 Type B NVIDIA® Quadro® Embedded A4500-8GB GDDR6 MXM Kit with Heatsink |
MXM-KIT-A4500-16GB |
|
MXM 3.1 Type B NVIDIA® Quadro® Embedded A4500-16GB GDDR6 MXM Kit with Heatsink |
MXM-KIT-A2000-8GB |
|
MXM 3.1 Type A NVIDIA® Quadro Embedded A2000-8GB MXM Kit with Heatsink |
MM-5C-8G/16G/32G |
|
DDR5-4800 8GB/16GB/32G SDRAM DIMM module |
WIFI-IN2550 |
|
Intel AX200NGW M.2 Wi-Fi 6 module w/2x30cm internal wires |
ANT-H11 |
|
1 x 2dBi HSUPA antenna |
ANT-D11 |
|
1 x WiFi dual-band 2.4G/5G antenna |
CoreTM i9-12900E |
|
Intel® 12th Gen. CoreTM i9-12900E processor, L3/30M, 2.3G |
CoreTM i9-12900TE |
|
Intel® 12th Gen. CoreTM i9-12900TE processor, L3/30M, 1.1G |
CoreTM i7-12700E |
|
Intel® 12th Gen. CoreTM i7-12700E processor, L3/25M, 2.1G |
CoreTM i7-12700TE |
|
Intel® 12th Gen. CoreTM i7-12700TE processor, L3/25M, 1.4G |
CoreTM i5-12500E |
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Intel® 12th Gen. CoreTM i5-12500E processor, L3/18M, 2.9G |
CoreTM i5-12500TE |
|
Intel® 12th Gen. CoreTM i5-12500TE processor, L3/18M, 1.9G |
CoreTM i3-12100E |
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Intel® 12th Gen. CoreTM i3-12100E processor, L3/12M, 3.2G |
CoreTM i3-12100TE |
|
Intel® 12th Gen. CoreTM i3-12100TE processor, L3/12M, 2.1G |
*CTOS means Configure-to-Order Service.